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D263T® Glass Wafers

Technical Specifications – Corning D263T®

PropertyValueUnit / Notes
Glass TypeAlkali-earth boroaluminosilicateHigh optical transmission glass
Density2.51g/cm³
Refractive Index~1.52@ λ = 587.6 nm
CTE (20–300°C)~7.2 × 10⁻⁶/K
Young’s Modulus~72GPa
Softening Point~820°C
AutofluorescenceVery lowIdeal for bioimaging
Transmission>91%Visible range (400–700 nm)
Surface QualityOptical polish availableRa ≤ 0.01 µm optional
ComplianceRoHS, REACHLead- and arsenic-free

Overview: What is Corning D263T® Glass?

Corning D263T® is a premium alkali-earth boroaluminosilicate glass engineered for high optical transmission, low autofluorescence, and excellent chemical durability. Manufactured using a precision down-draw process, it offers exceptional surface quality and dimensional stability, making it ideal for bioimaging, optical sensors, and MEMS packaging.

Compared to standard borosilicate substrates, D263T delivers superior performance in optical clarity, flatness, and chemical resistance, making it a go-to solution for demanding scientific and microfabrication applications.

Why Choose D263T® Glass Wafers for High-Precision Applications?

  • High Transmission: >91% light transmission in the visible spectrum
  • Low Autofluorescence: Perfect for microscopy and fluorescence imaging
  • Thermal Compatibility: Stable CTE and high softening point for processing
  • Ultra-Smooth Surface: Suitable for coating and thin-film deposition
  • Chemical Stability: Acid and alkali resistant, RoHS/REACH compliant
D263T® Wafer Supplier
custom D263T wafer manufacturer

Your Trusted D263T® Wafer Supplier – TiHot

At TiHot, we specialize in custom D263T glass wafer manufacturing for scientific and industrial needs. As a direct factory, we offer:

  • Custom shapes and ultra-thin thicknesses
  • CNC cutting, polishing, drilling, and micro-etching
  • ITO/AR/FTO/dielectric coating services
  • Rapid prototyping and low-MOQ orders
  • Global export with technical documentation and cleanroom packaging

D263T® Wafer Applications

  • Fluorescence microscopy slide substrates
  • Lab-on-glass biochip carriers
  • Optical filters and laser window baseplates
  • Thin-film optical coating substrates
  • Wafer-level bonding and MEMS packaging

People Also Ask (FAQ)

  1. Can D263T® glass wafers be customized in size and shape?
    Absolutely. TiHot supports custom wafer diameters (10–200 mm), rectangular/square formats, and custom thicknesses (0.1–1.1 mm), all processed to precise tolerances (±0.01 mm).
  2. Can D263T wafers be used for MEMS or microfluidics?
    Absolutely. Its chemical durability and surface precision make it ideal for MEMS, sensors, and biochip integration.
  3. Do you offer ITO or AR coatings on D263T wafers?
    Yes, TiHot provides custom ITO/FTO/dielectric/AR coatings for sensor, display, and imaging applications.
  4. Can D263T® wafers be drilled or patterned for microfluidic applications?
    Yes. We provide precision micro-drilling, slotting, and etching services for creating microchannels, sensor cavities, and fluidic interfaces on D263T® wafers.

Customizable D263T® Wafer Dimensions

Parameter Custom Range Notes
Shape Round / Square / Custom profile Based on drawing or specification
Diameter (Round) 10 mm – 200 mm 2″, 4″, 6″ standard sizes
Thickness 0.1 mm – 1.1 mm Ultra-thin supported
Thickness Tolerance ±0.01 mm – ±0.05 mm Based on application
Edge Type Ground / Chamfered / Safety beveled For safe handling and optical integration
Surface Finish Ground / Polished / Optical Ra ≤ 0.01 µm optional
Coating Options ITO / AR / FTO / Dielectric For optical, sensor, or display use
Packaging Cleanroom sealed / Protective film Double-sided protection available

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