Precision Glass Drilling Services
At Tihot Optics, we provide industry-leading glass drilling services specifically optimized for wafer-level packaging, semiconductors, microfluidics, and optoelectronic integration. Backed by over 15 years of experience in precision glass machining, we use advanced laser and ultrasonic drilling technologies to create clean, high-aspect-ratio holes in delicate and high-value glass substrates—without introducing cracks, stress, or contamination.
Whether you’re fabricating through-glass vias (TGVs), preparing substrates for MEMS, or building next-generation microfluidic devices, our solutions are engineered to meet the extreme precision and cleanliness required in today’s high-tech markets.
High-Precision Drilling Capabilities
Our facility is equipped to deliver micron-level hole placement accuracy, even on ultra-thin or chemically strengthened glass. Key capabilities include:
Hole diameter range: 0.05 mm to 5 mm
Thickness range: 0.1 mm to 10 mm
Aspect ratio: Up to 10:1 for deep microvias
Positional accuracy: ±5 µm
Hole types: Through-holes, blind holes, vias, and custom apertures
Material compatibility:
- SCHOTT BOROFLOAT® 33
- Corning EAGLE XG®, GORILLA®, D263T™
- Fused silica and quartz
- Other technical optical glasses
These capabilities make Tihot an ideal partner for R&D labs and production environments where geometry complexity, dimensional tightness, and material cleanliness are critical to success.
Typical Applications of Optical Glass Drilling
We support a wide range of industry use cases that rely on clean, precise glass holes:
Each project is managed with strict process control, including post-drilling inspection, cleaning, and traceable batch verification.
Hole Dimension Guidelines
We work closely with clients to define optimal drilling parameters. Our typical dimensional specifications include:
| Parameter | Specification |
|---|---|
| Minimum Hole Diameter | 0.05 mm |
| Maximum Hole Diameter | 5 mm |
| Glass Thickness Supported | 0.1 mm to 10 mm |
| Positional Tolerance | ±5 µm |
| Aspect Ratio | Up to 10:1 |
| Surface Finish | Smooth, with minimal chipping |
We can also accommodate custom geometries, including oval, square, or stepped-hole configurations upon request.
Why Choose Tihot Optics for Glass Drilling?
- 15+ years of industry experience in precision optical glass machining
- Specialized in high-end glass substrates used in semiconductors, AR/VR, and life sciences
- Advanced drilling systems, including multi-axis laser and ultrasonic drilling equipment
- Clean post-processing and edge inspection, enabling direct integration without additional cleaning
- ISO 9001-compliant workflows and traceable QA records for every batch
- Official partner of SCHOTT and Corning, ensuring deep material expertise and full traceability
Our team of engineers can assist with prototyping, small-batch runs, and high-volume production with equal agility and professionalism.
Partner with Us for Precision Glass Drilling
We are committed to working closely with our clients to deliver the most accurate and reliable glass drilling results. Whether you’re developing prototypes or preparing for high-volume semiconductor production, our engineering team is here to support you at every stage.
Simply provide us with your CAD files or drawings (including formats such as PDF, JPG, BMP, or GIF), and we’ll take care of the rest—from programming to final inspection. From one-off custom pieces to large production runs, we have the tools and experience to handle your most challenging drilling specifications with confidence and precision.