产品: Pyrex Glass Wafer
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Pyrex Glass Wafer
| Wafer Spec | Value |
|---|---|
| Available Thicknesses | 0.2 – 1.4 mm |
| Standard Thicknesses | 0.5, 0.7, 0.85, 1.1, 1.4 mm |
| TTV | ≤ 10 µm (standard), ≤ 1 µm (optional) |
| Warp | ≤ 100 µm |
| Diameters | 100 / 150 / 200 mm (others on request) |
| Surface Finish | Double-side polished (Ra as requested) |
| Panel Spec | Value |
|---|---|
| Available Thicknesses | 0.4 – 1.4 mm |
| Standard Thicknesses | 0.5, 0.7, 0.85, 1.1, 1.4 mm |
| Length × Width | Up to 600 × 800 mm |
| TTV | ≤ 10 µm (standard) |
| Warp | ≤ 500 µm |
Product Overview
Corning® PYREX® Micro-Eglass builds upon decades of Corning innovatiorand the trusted legacy of PYREXG® in the semiconductor industry. Manufactured witCorning’s advanced fusion-draw process, this borosilicate glass delivers an opticagrade, pristine surface, exceptionally low total thickness variation, and a coefficientnermalexoansiemaking it ideal for numebonding methods to Si-l. Available in a wide range of thicknesses ancformats, Corning@ PYREX@ Micro-Electro glass meets the evolving requirements ofdevices demanding optical-grade glass for semiconductor processingApplications
- MEMS.
- Optical sensors
- Wafer-level capping/packaging
Manufacturing & Processing Capabilities
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Precision dicing (round/rectangular; flats/notches); edge bevel/chamfer
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Double-side polishing / CMP (Ra down to ≤0.02 µm on request)
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TGV / micro-holes: laser drilling or wet etch per drawing
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Pockets, cavities, alignment marks, scribe/ID marking
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Coatings: AR, ITO, Cr/Au, Ni/Cr, hydrophilic/hydrophobic/AF, hardcoat
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