Specification Data
Thickness Range :0.2 mm – 2.0 mm
Max Dimensions Up to 200 mm × 200 mm
Material Options: B270®, D263T®, BOROFLOAT® 33, Quartz
Optical Transmission :≥ 90% (400–700 nm)
Etching Type Laser or Chemical, Depth 10–100 μm
Surface Finish Polished, AR-coated, Anti-glare optional
Edge Treatment Stepped, C-cut, Beveled, Embedded
Thermal Stability Up to 400°C (material dependent)
Etched glass covers are precision-processed glass substrates featuring micro-etched patterns or recessed geometries, specifically designed for use in LED and OLED module packaging. These covers serve as optical windows and protective layers during the encapsulation process, offering high light transmission, excellent bonding compatibility, and thermal durability.
An etched glass cover can include microgrooves, alignment marks, anti-glare textures, or embedded notches to optimize assembly and light performance.
TIHOTOPTICS provides custom etched glass covers tailored to various LED/OLED packaging demands.
Etched glass covers are ideal for:
They enhance adhesion, improve light diffusion, and protect sensitive chip surfaces during thermal and mechanical processing.
Etched glass covers provide several advantages:
What does an etched glass cover do in LED packaging?
It acts as a transparent seal and optical interface, improving bonding and reducing light scattering losses during LED or OLED packaging.
Can etched glass be used in OLED encapsulation?
Yes. Etched glass is suitable for OLED displays, where it offers low-stress bonding, high clarity, and chemical stability during encapsulation.
What materials are used for etched LED covers?
Common options include B270®, BOROFLOAT® 33, D263T™, and fused quartz—selected based on thermal needs and optical performance.
What’s the benefit of recessed glass in LED modules?
Recessed designs fit tightly into modules, improve optical alignment, and reduce stress on encapsulants.
Are custom shapes available for LED covers?
Yes. Shapes such as round, square, or with notches, slots, or stepped sides are fully customizable based on module design.
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